Wireless charger pcba,Infrared SMT assembly sensor pcba,China OEM pcba manufacturer
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Specification of PCBA assembly
PCBA Type of Assembly | SMT,DIP, Mixed(surface mount and through hole) technology,Cable assembly |
Solder Type of electronic PCBA | Water Soluble Solder Paste,Leaded and Lead-Free |
Minimum IC Pitch for OEM PCBA | 0.2mm |
Minimum chip size PCBA board | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size SMT Assembly PCBA | 74x74mm |
BGA ball pitch PCBA | 1.00mm (minimum),3.00mm (maximum) |
BGA ball diameter Pcba Assembly | 0.40mm (minimum),1.00mm (maximum) |
Components | BGA and VFBGA |
Leadless Chip Carriers/CSP |
Double-sided SMT Assembly pcba |
Fine Pitch to 0.8mils |
BGA Repair and Reball |
Passive components |
As small as 0402 package |
As small as 0201 with design review |
Ball Grid Arrays(BGA) |
As small as .5mm pitch |
Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches |
Largest:20*20 inches |
File Formate | Bill of Materials |
Gerber files |
Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | First prototype test before mass quantity production,Flying Probe Test,X-ray Inspection AOI Test,BGA X-ray, PCB E-test
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