1. phone pcb and company advantage :
High quality phone pcb, professional service,low cost pcb
Reputable manufacturer , own factory
UL,SGS,ISO,TS,CQC certification
OEM and ODM service
Keep cost to minimum , maximize your benefit
Quick delivery time
2.The detailed specification of phone pcb :
Material | FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc. |
Layer counts | 2-28 layers |
Finished Copper Thickness | 0.5-5 OZ |
Finished Board Thickness | 0.2-6.0mm |
Min. Line/Track Width | 3mil |
Min. Line/Track Space | 3mil |
Min. Contour Tolerance | +/-0.1mm |
Min. Finished Diameter of PTH Hole | 0.2mm |
Max. Board Thickness/Hole Ratio | 12:1 |
Min. Solder Mask Bridge | 4mil (Min. SMT Pad Space 8mil) |
Min. Legend (Silk screen) Track Width | 5mil |
Min. Legend (Silk screen) Height | 30mil |
Min. drilling slot size | 0.6mm |
Solder mask color | green, black, blue, white, yellow, purple, and matt, etc. |
Solder mask hardness | 6H |
Legend/Silk screen Color | white, yellow, black, etc. |
Surface Treatment | HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc. |
Other Technology | Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc. |
Reliability Test | flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc. |
Wrap and twist | ≤0 |
Flammability | 94V-0 |
Detailed Terms for PCB Assembly:
Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology Various sizes like 1206, 0805, 0603 components SMT technology ICT(In Circuit Test), FCT(Functional Circuit Test) technology PCB Assembly With UL, CE, FCC, Rohs Approval Nitrogen gas reflow soldering technology for SMT High Standard SMT&Solder Assembly Line High density interconnected board placement technology capacity |
Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate |
OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA PCBA and enclosure design Components sourcing and purchasing Quick prototyping Plastic injection molding Metal sheet stamping Final assembly Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) Custom clearance for material importing and product exporting |
Other PCB AssemblyEquipment | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 Reflow Oven: FolunGwin FL-RX860 Wave Soldering Machine: FolunGwin ADS300 Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |