Subjects | Parameters |
Board | Common FR4 board: ShengYi, LianMao ,JianTao |
Special board: Rogers Ya Dragon Nelco ISOLA |
High TG: ShengYi: s1000-2 LianMao:IT180) |
Surface Treatment | Antioxidation, Soldering, Lead-free Soldering, Immersion Gold, Immersion Silver,Gold Plated, Whole Board Gold Plated, Connecting Finger, ENEPIG |
Finished Product Tolerance Control | Thickness≤1.0mm:+/-0.1mm 1.0mm<Thickness≤2.0mm:+/-10% Thickness>2.0mm:+/-8% |
Plated-through Hole):+/-3mil,Non-mental Holes:+/-2mil |
Appearance of Tolerance): Length≤100mm:+/-0.1mm 100<Length≤300mm:+/-0.15mm Length>300mm:+/-0.2mm |
Technical Parameters | Min Line Width/Distance):3mil/3mil |
Min Hole Diameter): Mechanical Drilling)—0.15mm Laser Drilling)—0.1mm |
Min Welded Ring):4mil |
Max Copper Thickness :12oz |
Max Size of Finished Product): Two-sided≤600mm*1200mm ≤500mm*1200mm |
Range of Board Thickness): Two-sided0.2—7.0mm 0.4—7.0mm |
Anti-soldering Bridge≥0.08mm |
Board Thickness Aperture Ratio):15:1 |
Taphole Ability):0.2—0.8mm |
Gold/Ni Thickness Control): 1,Immersion Chemical Nickel Gold:Au,1—10u” 2,Connecting Finger:Au,1—150u” 3,Whole Board Gold Plated:Au,1—3u” 4,Whole Board Solid Gold Plated:Au,1—150u” 5,Nikel thickness:50—500u” 6,ENEPIG:Pd,2—5u”,Au,1—8u” |