First of all, learn the capability of PCB and PCB Assembly 1). Features of pcb boardLayer1-20 layerMaterialFR-4,CEM-1,CEM-3,FR4 Halogen Free,FR-1,FR-2,AluminumBoard thickness0.2mm-4.0mmMax.finished bo
First of all, learn the capability of PCB and PCB Assembly
1). Features of pcb board
| Layer | 1-20 layer |
| Material | FR-4,CEM-1,CEM-3,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| Board thickness | 0.2mm-4.0mm |
| Max.finished board side | 500mm*500mm |
| Min.drilled hole size | 0.25mm |
| Min.line width | 0.075mm(3mil) |
| Min.line spacing | 0.075mm(3mil) |
| Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold, Immersion gold
Immersion Silver/Gold,Osp,Gold Plating |
| Copper thickness | 0.5-6.0oz (18 um-210 um) |
| Solder mask color | green/black/white/red/blue/yellow |
| Inner packing | Vacuum packing,Plastic bag |
| Outer packing | Standard carton packing |
| Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| Certificate | UL,ISO9001,ISO14001,ROHS,CQC |
| Profiling Punching | Routing,V-CUT,Beveling |
| Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2). Property of pcb assembly service
Quantity | PCB Prototype&Low Volume PCB Assembly |
Type of Assembly | SMT, Thru-hole, DIP |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free, ENIG/ENIS |
Components | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Bare Board Size | Smallest:0.25*0.25 inches |
Largest:20*20 inches | |
File Formate | Bill of Materials |
Gerber files | |
Pick-N-Place file | |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection, AOI Test |
PCB Assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
