Item | Capability |
1.Base Material | FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC |
2.Layers | 1-22 |
3.Finised inner/outer copper thickness | 1-6OZ |
4.Finished board thickness | 0.2-7.0mm |
Tolerance | Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% |
5.Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
6.Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
7.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Drilling precision: first drilling | First drilling: 1mil Second drilling: 4mil |
8.Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
9.Controlled Impedance | +/-5% |
10. Aspect Ratio | 15:1 |
11.Min welding ring | 4mil |
12.Min solder mask bridge | ≥0.08mm |
13.Plugging vias capability | 0.2-0.8mm |
14. Hole tolerance | PTH: +/-3mil NPTH: +/-2mil |
15.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
16.Surface treatment | OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ |
17. E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) |
FQC-Physical Lab: Reliability tests |
18.Certificate | ROHS UL:E327776 ISO9001:2008 IPC SGS |
Our equipments |
1.Drilling workshop | 4 drilling bits of drilling machine: 4 sets 2 drilling bits of drilling machine: 2 sets |
2. photo plotting workshop | Israel “ORBOTECH” Photo Plotters |
3.AOI | AOI machine |
4.IPQC | “OXFORD” CMI 700 Copper Thickness Tester |
5.Impedance test | USA “Tektronix” DSA 8200 Impedance Tester |
6.Outline workshop | CNC routing machine: 7 sets angle-cutting machine V-cut machine |
7.Testing Workshop | Surpass X-600: 2sets WTD FT-2808: 5sets WTD HV300: 1set |
8.X-ray | X-ray machine |