Our engineering team has extensive experience in DFM/DFA/DFT technologies. SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can be cut and delivered inside of 4 hours.
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ), Daily capacity can reach to 11,000,000 millions components.
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Product Type: | Printed Circuit Board Assembly |
Material: | FR4/Polyimide |
Layers: | 1-22 |
Solder Mask: | green, yellow,white, blue,black |
Finished Surface: | Lead-free HASL,Immersion Gold,ImmersionSilver |
Plugging Visa capability:: | 0.2-0.8mm |
Min Solder Mask Bridge: | 0.08mm |
Minimum line width/gap: | 3.5/4mil(laser drill) |
Minimum hole size: | 0.15mm(mechanical drill)/4mil(laser drill) |
Thicker Copper: | 0.5-6OZ |
Plated holes Tolerance: | 0.08mm(min±0.05) |
Non-plated hole tolerance: | 0.05min(min+0/-0.05mm or +0.05/-0mm) |
Outline Tolerance: | 0.13min(min±0.10mm) |
Insulating resistance : | 0 ohms (mormality) |
E-Test voltage : | 500V+15/-0V 30S |
Warp and Twist: | 0.7% (semiconductor test board≤0.3% ) |
PCB Aassembly Capability
POE main SMT production line consists of automated high-precision state-of-the-art equipments from Panasonic,Samsung,Japan total 6 lines(Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm~50mm gap,+/-0.05 accuracy),Daily capacity can reach to 11,000,000 components.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.SMT,BGA Rework,Re-balling,X-Ray are all readily achieveable.Stencils can be cut and delivered inside of 4 hours.
Delivery Time |
Order Conditions | Standard Delivery Date | The fastest Delivery Date |
Prototype ( <20pcs) | 2days | 8hours |
Small Volume (20-100pcs) | 3days | 12hours |
Medium Volume (100-1000) | 6days | 24hours |
Mass Production (>1000) | Depends on BOM | Depends on BOM |