PCB Manufacture Capacity |
Item | Specification |
Material | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
Remarks | High Tg CCL is Available(Tg>=170℃) |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Shape | Routing,Punch,V-cut,Chamfer |
Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
Silkscreen(black, yellow, white) |
Peel able-mask(red, blue, thickness>=300um) |
Minimum Core | 0.075mm(3mil) |
Copper Thickness | 1/2 oz min; 12oz max |
Min Trace Width & Line Spacing | 0.075mm/0.075mm(3mil/3mil) |
Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
Min Hole Diameter for Punching | 0.6mm(35mil) |
Biggest panel size | 610mm * 508mm |
Hole Position | +/-0.075mm(3mil) CNC Drilling |
Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
Non PTHL:+/-0.05mm(2mil) |
Outline Tolerance | +/-0.1mm(4mil) CNC Routing |
Warp & Twist | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test Voltage | 10-300V |
Panel Size | 110 x 100mm(min) |
660 x 600mm(max) |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
6 layers:0.25mm(10mil)max |
Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |